Rigid-Flex PCB – Jerico

Jerico

Rigid-Flex PCB

What’s in Rigid-Flex PCB?

Rigid-Flex PCBs are a type of circuit board that uses both flexible and rigid materials. Rigid-Flex PCBs are a great way to combine different PCB parts, like displays, input or storage devices, with thin, lightweight materials that make wiring easier by hiding it in thin, flexible strips between sections.

Rigid-Flex PCBs are perfect for packaged electronic designs. Rigid-Flex PCBs combine the component and routing density of rigid boards with the flexibility of flexible circuits. This allows designers to achieve a high level of routing density and interconnectivity that is not possible with other types of boards.

Rigid-Flex PCBs are mainly used in military, medical and camera applications. But they are being used more and more in other electronic devices. They cost more than traditional PCBs because they need more raw materials. But in the right situations, they work better and are better value for money.

 

Applications of Rigid-Flex PCBs

  • Aerospace and Defense: Rigid-flex PCBs are used in avionics, satellites and military equipment because they can withstand harsh environments and are lightweight.
  • Medical devices: Wearable medical devices, implantable electronics, and surgical instruments often use rigid-flex PCBs because they are small and reliable.
  • Automotive Electronics: Rigid-flex PCBs are used in car control modules, sensors and infotainment systems where space is limited and reliability is important.
  • Consumer Electronics: Smartphones, tablets and wearables use special circuits called rigid-flex PCBs. These allow them to be slim and compact but still work well.

 

JERICO Rigid-Flex PCB Manufacturing Capability

 

Feature Parameters
Quality Standard IPC Class 2(default) and IPC Class 3
Layer Count Up to 16L
Material Polyimide(PI) + FR4
Min.Line/Track Width 4mil
Min. Hole Size >0.15mm
Surface Finish ENIG, OSP, Immersion Silver
Lead Time 2~3 weeks

 

Making rigid-flex pcb starts with choosing the right materials. This includes picking the right FR4 substrate for the rigid part and high-performance polymers such as polyimide (PI) for the flexible part. These materials need to have excellent electrical properties and mechanical strength, and also be able to adapt to high temperatures and chemicals.

Lamination is an important step in the manufacturing process. At this stage, the two materials are combined together using special adhesives and high temperatures. This process requires precise control of temperature and pressure to ensure a close bond between the materials and avoid subsequent delamination or bubbles.

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