Its core lies in breaking through the physical limitations of traditional PCBs to meet the demands of miniaturization and high performance of modern electronic products, according to the IPC (Global Electronics Association) standard.
HDI PCBs need to meet at least 1 one of the following 5 technical indicators:
- Aperture ≤ 6 mil (0.15 mm),
- Ring diameter ≤ 10 mil (0.25 mm),
- Contact density > 130 points per square inch,
- Wiring density > 117 inches per square inch,
- Line width/spacing ≤ 3 mil/3 mil (0.076 mm)
JERICO HDI PCB Manufacturing Capability
| Feature | For Mass Production | For Sample |
| Layers | 4-16 Layers | 4-24 Layers |
| Board Thickness | 0.6-3.2mm | 0.4-6.0mm |
| Maximum Sequential Lamination Steps |
4+N+4 | Any layer interconnected |
| Minimum Laser Drilled Via | 4mil (0.1mm) | 3mil (0.075mm) |
| Laser Ablation Process | CO2 Laser Machine | CO2 Laser Machine |
| Glass Transition Temperature (Tg) | 140/150/170°C | 140/150/170°C |
| Plated Through-Hole Copper Thickness |
12-18μm | 12-18μm |
| Impedance Tolerance | +/-10% | +/-7% |
| Layer-to-Layer Registration | +/-3mil | +/-2mil |
| Solder Mask Registration | +/-2mil | +/-1mil |
| Minimum Trace Width/Space | 2.5/2.5mil | 2.0/2.0mil |
| Minimum Annular Ring | 2.5mil | 2.5mil |
| Minimum Through-Hole Diameter | 8mil (0.2mm) | 6mil(0.15mm) |
| Minimum Microvia Diameter | 4.0mil | 3.0mil |
| Minimum Dielectric Thickness | 3.0mil | 2.0mil |
| Minimum Land Pad Size | 12mil | 10mil |
| Microvia Aspect Ratio | 1:01 | 1.2:1 |
What are the key enablers for high-performance circuit boards in High-Density Interconnect (HDI) technology?
Undoubtedly, the critical factors lie in the precision processing of microvias, blind vias, and buried vias. JERICO PCB specializes in R&D and innovation of these core technologies, delivering premium HDI solutions to our clients.
Our technical strengths in via processing include:
- Blind Via Technology
Utilizing advanced photolithography and precision lamination processes, we ensure micron-level positional accuracy and smooth via walls (Ra<0.8μm). This significantly enhances circuit reliability and signal integrity.
- Microvia Drilling
With industry-leading laser drilling systems (UV/CO), we achieve microvia diameters down to 0.1mm with ±0.01mm positional tolerance. This precision minimizes signal loss while boosting electrical performance.
- Buried Via Integration
Our multilayer stacking and high-precision registration (alignment error <25μm) enable higher wiring density and complex designs. Buried vias optimize spatial efficiency and electrical characteristics.
- Customization Capabilities
We provide comprehensive customization services—from specialized materials (e.g., low-Dk/Df laminates) to unique design specifications—ensuring solutions tailored to your requirements.
- Quality Assurance
Implemented stringent quality control throughout the manufacturing lifecycle:
- Raw material certification (UL/ROHS compliant)
- In-process monitoring (AOI/AXI testing)
- Final inspection (impedance control ±7%, TDR-verified)
- Partner with JERICO PCB for HDI technology that empowers your products to outperform in competitive markets
