Process Capability
| Item | Feature | Capability | Remark |
| Basic Parameter | Number of Layers | 32 layers | |
| Surface treatment | Lead HASL, Lead-Free HASL, ENIG, OSP, Golden finger, selective ENIG, hard gold plating | ||
| Board thickness range | 0.2--6.0mm | Normal board thickness: 0.6/0.8/1.0/1.2/1.6mm; Multi-layer PCB min. thickness will be different based on the layer count, and special material need to be pre-ordered |
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| PCB type | FR-4, CEM-3,high-frequency board,metal substrate,heavy copper, etc. | Special material need to be pre-ordered | |
| Circuit | Min. trace width and spacing | ≥2/2mil(0.05mm/0.05mm) | It is recommended to increase trace width and spacing if conditions permit. |
| Min. etched font width | ≥8mil(0.20mm) | 8mil(finished copper thickness 1 OZ), 10mil(finished copper thickness 2 OZ), 12mil(finished copper thickness 3 OZ) | |
| Min. BGA | ≥10mil(0.25mm) | ||
| Finished external copper thickness | 17--210μm | ||
| Finished inner copper thickness | 8-140μm | ||
| Clearance and profile spacing | ≥8mil(0.20mm) | Routing, the distance between the circuit and profile should be no less than 0.25mm; For V-cut, the distance between the circuit and the middle line of V-cut should not less than 0.45mm; Special requirements for lower distance or just close to the edge, need to accept the side of the pad exposed copper; the distance between PAD and copper should not less than 0.18mm. |
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| Effective circuit bridge | 4mil(0.1mm) | Refers to the trace width of two pieces of copper in the circuit. | |
| Drilling | Min. via diameter(machine drilling) | 0.2mm | Mechanical hole min. diameter 0.2mm, better make it more than 0.3mm if permitted; hole diameter tolerance is ±0.075mm, bias less than 0.05mm, 2nd drilling bias less than 0.10mm |
| Min. via diameter(laser drilling) | 0.075mm | Via diameter tolerance is: ±0.01mm, bias less than 0.01mm, 2nd drilling bias less than 0.10mm | |
| Min. slot aperture(machine drilling) | 0.6mm | Tolerance is ±0.1mm | |
| Stamp hole | 0.35mm | Stamp hole spacing 0.25mm,added to the center of the outer frame,the number of stamp holes need to be no less than 3. | |
| Plug hole diameter | ≤0.5mm | If more than 0.5mm, solder mask will cover the pad | |
| Via single-sided solder ring | 4mil(0.1mm) | Via min.: 4mil, component hole min.: 6mil, increase the via solder ring help the current pass. | |
| Solder mask | Solder Mask color | white, black(bright black, matte black), blue, green, yellow, red etc.. | |
| Solder bridge | Green oi ≥0.1mm | Make solder bridge need the pad spacing ≥0.18mm(pad for Motley oil ≥0.2mm), the thicker the copper, the greater the spacing | |
| Motley oil ≥0.12mm | |||
| Black & white oil ≥0.15mm | |||
| Component mask/legend | Min. legend width | ≥0.6mm | If less than 0.6mm, may not clear enough. |
| Min. legend line width | ≥0.13mm | 0.13mm the corresponding character height is 0.8mm; | |
| Min. legend height | ≥0.8mm | If less than 0.8mm, may not clear enough. | |
| Distance between Top Overlayer and Solder Mask | ≥0.2mm | If less than 0.2mm, during production, the default is to move or cut, and the line width of the character box is insufficient. | |
| Legend aspect ratio | 0.5:1 | Best ratio for production. | |
| Shape | Min. slot cutter | 0.60mm | Min. copper slot width 0.60mm |
| Max. size | 550mm x 560mm | Specify if there is any special. | |
| PTH tolerance | ±0.075mm | ||
| NPTH tolerance | ±0.05mm | Solder Mask Expansion ≥0.15mm,to prevent oil from entering the hole. | |
| Hole position tolerance(first drilling) | ＜0.05mm | ||
| Hole position tolerance(2nd drilling) | ＜0.1mm | ||
| Tolerance of board thickness | (T≥1.0mm)± 10% (T＜1.0mm)±0.1mm |
Eg: board thickness T=1.6mm, physical board thickness=1.44mm (T-1.6×10%)~1.76mm(T+1.6×10%); | |
| Profile Tolerance | Routing ±0.1mm V-cut ±0.3mm |
Specify if there is any special. | |
| Panelize: No gap panelize | 0mm | V-cut delivery | |
| Panelize: Array | ≥1.5mm | ||
| Technical Parameter | Flame retardancy | 94V-0 | |
| Impedance type | Single-ended, differetial, coplanar (single-ended, differential) | Please remark it in the PCB files | |
| Special process | Resin for vias, buried | ||
| Design Software | Pads software | Hatch Mode copper laying | The default is to restore copper paving, which is designed with pads customers must pay attention to. |
| Minimum fill pad≥0.0254mm | When designing the minimum custom pad, pay attention to the minimum D-code size filled cannot be less than 0.0254mm. | ||
| Protel 99se software | Special d-code | A few engineers use special D code in the design, and the D code is easy to be replaced or lost in the process of data conversion, resulting in data problems | |
| Off-board object | The design engineer mistakenly placed the component far beyond the PCB board, and the conversion process was unable to output due to the size boundary being too large | ||
| Altium Designer software | version problem | Altium Designer software have version series, and poor compatibility, design files need to indicate the use of software version number | |
| Luxi mono | Special fonts need to be specified and may be replaced by other fonts. | ||
| Protel/dxp Window Layer in software | Solder Layer | A few engineers mistakenly put the paste layer, and the PCB does not process the paste layer |
