Blog Page 2 Jerico

1. Why Blind and Buried Via PCB Matters for Modern Electronics With the rapid development of industrial automation, automotive electronics, medical devices, and communication systems in Germany, PCB designs are becoming increasingly compact and high-density. Traditional through-hole PCBs can no longer meet these requirements. This is where Blind Via and Buried Via PCB technology (HDI…

The global electronic procurement landscape in 2026 has undergone a fundamental shift. For years, procurement officers and engineering leads prioritized the lowest unit cost above all else. Today, that narrow focus has been replaced by a more survivalist strategy: supply chain resilience and deep technical partnership. As rapid-fire innovation cycles in AI, medical, and EV…

As automotive electronics continue to evolve, the reliability requirements for printed circuit boards (PCBs) have become significantly more demanding. Modern vehicles now integrate a wide range of electronic systems, including advanced driver assistance systems (ADAS), engine control units (ECUs), battery management systems (BMS), and vehicle communication modules. These systems rely heavily on high-performance PCBs that…

In today’s global electronics landscape, balancing environmental compliance, rapid development, and cost efficiency has become a daily challenge for design engineers and NPI managers. Projects destined for the U.S. or Europe often face strict RoHS and REACH audits. Yet many teams still rely on tin‑lead finishes, resulting in delayed approvals, failed audits, and unplanned redesigns….

Why Should Engineering Teams Seriously Evaluate FR4 HiTg170 4-Layer PCBs? Engineering teams working on motor control, power conversion, automotive controllers, LED drivers and telecom equipment are constantly fighting a triple constraint: high temperature, high power density and aggressive cost targets. In many of these applications, the environment sits in the 80–125 °C range for long periods,…