As the hardware cornerstone of modern electronic systems, PCB (printed circuit board) plays a core supporting role in the development of the communications industry. In the communications industry, PCB is not only the “connector” of electronic components, but also the “invisible engine” of communication technology breakthroughs with the development of 6G, space-air integration, and computing power networks. From 1G to 6G, every leap in communication technology has forced the upgrade of PCB technology, and the innovation of PCB has provided the hardware foundation for the communication system to break through the performance boundary, so the development of circuit boards and communication technology has been “spiraling”. For example, 5G millimeter wave promotes the maturity of HDI technology, and the demand of the communication market forces the innovation of PCB. At the same time, PCB breakthroughs enable new communication scenarios, such as flexible PCBs that enable wearable health monitoring. The development of circuit boards and communication technologies has always been closely intertwined, and the two promote each other and develop together. From the early simple circuit interconnection to the current support of 6G, terahertz communication, and quantum information processing, it carries multiple core functions such as information transmission and heat dissipation management. The progress of PCB technology also directly determines the performance upper limit of the communication system.

From a technical point of view, PCB plays a core role in various fields of communication through the update of materials and technologies.

• Mobile phone/mobile terminal: The core of HDI technology realizes 10Gbps+ transmission between chips. Multilayer HDI PCB realizes high integration and high-speed interconnection of processors, baseband, RF, memory, camera, sensor, etc.
• Base station: High-frequency and high-speed PCB is used for the RF transceiver unit, power amplifier, and filter in AAU/RRU.
• Optical fiber communication equipment: PCB inside high-speed backplane, line card, and optical module carries high-speed SerDes chip, drive circuit, photoelectric conversion device, and processes ultra-high-speed electrical signal
• Satellite communication: Polyimide substrate with working range of -180℃~+260℃, high-performance, high-reliability, and radiation-resistant PCB with PCB surface accuracy of ±0.025mm/m.

As a professional PCB manufacturer, Jerico has the following advantages in the field of communication, especially in high-end applications such as 5G base stations, optical modules, and satellite communications:

• Comprehensive portfolio of RF/microwave laminates: Rogers (RO4000/RO3000 series), Taconic (TLY/SP series), Isola (Astra MT77), and other full range of high-frequency materials, supporting 6GHz~110GHz frequency band design.
• Dielectric constant (Dk) control accuracy: ±0.05 (industry average ±0.1), ensuring millimeter wave phase consistency.
• Any-layer HDI: Support 1-3 order HDI design, laser drilling aperture ≤75μm (industry generally 100μm), wiring density increased by 40%.
• Impedance test tolerance ±3% (industry ±5%), suitable for 112Gbps high-speed transmission.

The future technological evolution of the communications industry (such as 6G, terahertz communication, integrated space-ground network, etc.) will put forward higher-dimensional requirements and new breakthroughs for circuit boards (PCBs). For example, in the field of terahertz communication, new dielectric materials with Dk<2.0 (such as liquid crystal polymer LCP) will be needed. In the field of co-packaged optics (CPO), PCB is integrated with optical engine, requiring ultra-low warpage (≤ 0.1%. In the 6G In the Sub-THz field, it will be necessary to develop nanocomposites with Df < 0.001.