Blog – Page 2 – Jerico

For power design engineers pushing the limits in electric vehicles, server racks, or industrial drives, a common and costly assumption persists: to carry more current, simply widen the copper trace. However, when currents surpass the 10A threshold, this approach not only fails but can actively undermine reliability. This article moves beyond basic IPC-2152 charts to…

Every high-speed digital or RF engineer has experienced this frustration: your PCB stackup calculator shows perfect 50Ω impedance, but the physical board measures 42Ω or 58Ω. This gap between calculation and reality isn’t just a minor discrepancy—it’s a direct threat to signal integrity, system performance, and project timelines. The problem isn’t your calculator; it’s the…

For engineers and quality technicians, a multimeter is the first line of defense against PCB failures. Yet what separates basic functionality verification from professional-grade reliability testing? This comprehensive guide moves beyond simple continuity checks to provide systematic methodologies for identifying manufacturing defects in complex boards. Whether you’re debugging a new prototype or validating production units,…

In PCB design, the humble via and plated through hole (PTH) are foundational elements, yet their misapplication is a leading cause of field failures, thermal issues, and signal degradation. While often used interchangeably, PTHs and vias serve distinct electrical, mechanical, and thermal purposes. Confusing them leads to inefficient designs, inflated costs, and compromised reliability. This…

For electronics engineers and procurement managers pushing the boundaries of 5G, automotive radar, and high-speed computing, the printed circuit board (PCB) is no longer a passive component. At gigahertz frequencies, it becomes a critical active element that can make or break system performance. Signal degradation, impedance mismatches, and thermal issues inherent in standard materials pose…