What is PCB Cloning

PCB cloning, also known as PCB reverse engineering or PCB replication. It refers to the existing circuit board in kind under the premise of reverse analysis of the circuit board, re-create the original design of the way to design PCB, so as to complete the original circuit board samples of the complete copy

PCB Cloning Process

1. Pre-preparation

Obtain the original PCB in kind and record the basic information: including the number of layers, dimensions, materials, key device models, etc.

2. Remove components and Cleaning

Remove components: Record the model number, location, and direction of all components (e.g. ICs, capacitors, polarized components, etc.).

Clean the board surface: use alcohol to remove solder, stains, to ensure that the alignment and pads are clearly visible.

Handling multilayer boards: In case of multilayer boards, peel off layer by layer (by sanding or chemical etching) and record the structure of each layer.

3. Image Acquisition and Processing

HD Scanning/Photographing: Use a high DPI scanner (≥600dpi) to scan by area to ensure no distortion.

Image processing:Adjust contrast and sharpen alignment with Photoshop; Calibrate the scale (e.g., use a ruler to measure the actual size and pixel correspondence).

4. Schematic and PCB Layout Reconstruction

• Schematic Drawing: Draw the schematic according to the connection relationship of the alignment and label the parameters of the components.
• Layout Restoration: Place the components according to the original position, and reproduce the alignment, copper laying, and vias.
• DRC checking: run design rule checking (spacing, line width, etc.) to correct errors.

5. Generate production files

• Output Gerber file: Contains a photolithography file for each layer (copper, silkscreen, soldermask).
• Drill file: Generates Excellon file with drill locations and dimensions.
• BOM List: List all component models, quantities, bit numbers.

6. PCB Prototype and Testing

PCB Prototype: Send Gerber file to PCB factory to make board, and procure components according to BOM and solder them.

Function test: power on test, check the voltage, signal is normal. Use appropriate test equipment and methods according to pcb usage and compare the performance of the original board (e.g. signal integrity, power consumption).

The Legal Boundary of PCB cloning

Reverse engineering serves as a crucial technological driver in the advancement of the integrated circuit industry. Nevertheless, its legal status has remained a subject of ongoing debate since its emergence. Notably, China’s judicial system has provided specific legal clarifications on this matter. In January 2007, China’s Supreme People’s Court announced the Interpretation of Several Issues Concerning the Application of Laws to the Trial of Civil Cases of Unfair Competition, which stipulates that trade secrets obtained through self-development and development or reverse engineering are not recognized as infringement of trade secrets under the relevant provisions of the Law Against Unfair Competition. Therefore, when designing PCB clones, several key legal issues need to be strictly followed: e.g., copyright infringement, patent application, trademark infringement, trade secrets, etc. Non-compliance with these legal parameters may result in significant litigation risks, warranting meticulous attention during the design process.