Heavy Copper PCB for High Power & Reliability

What’s in Heavy Copper PCB?

Heavy copper printed circuit boards are special PCBs that use ultra-thick copper layers (≥4 oz/140μm, up to 20 oz/700μm or even thicker) to meet the needs of high current & strong heat dissipation & high reliability. And this kind of PCB can offer better solutions for overheating and burnout issues in standard PCBs under high-current conditions. Its most important feature is that the thickness of the copper layer (conductor and copper-plated area) on the circuit board is much thicker than that of a standard PCB. It is mainly used in high-power fields such as new energy, industrial power supplies, and automotive electronics. It is a key technology that breaks through the performance limits of ordinary PCBs. Compared with ordinary PCBs, heavy copper circuit boards are thicker in appearance than ordinary PCBs, and the thickness of the copper layer in the cross-section is 5-20 times that of standard PCBs. Because the heavy copper circuit board has a high proportion of copper, the weight of the entire board is heavier than that of standard PCBs as well.

What kind of products or fields need to use heavy copper circuit boards:

Power supply system of high-power power supply, like UPS, inverter, frequency converter, and charging pile.
Photovoltaic inverter, wind power controller, energy storage system, and other related new energy industries
High-power LED fields related to stage lights, industrial lighting, and car headlight driver boards.
Aerospace and military fields such as radar power supply, flight control systemand ship power distribution

Heavy copper PCB production factory needs special process equipment and strict process control. We, Jerico PCB, have abundant production experience in this regard:

A variety of high TG materials (≥170℃) and low CTE (≤50ppm/℃) for options, like ISOLA 370HR, Panasonic Megtron 6, etc.
We have the copper foil processing system that supports the cutting and lamination of ultra-thick copper foil (4-20+ oz), and features a temperature and humidity-controlled copper foil storage (23±2°C/50% RH).
We provide step etching technology, enabling multiple etching cycles with resist protection to control thick-copper trace sidewall angles (70°-85°), achieving ≤15% line width deviation after 20oz copper etching.
Our factory is equipped with a pulse plating system and has deep-hole plating capability, with a current density range of 1.5-2.5 ASD (Amperes per Square Decimeter).
We offer embedded copper block technology, with CNC-milled slot accuracy of ±0.05mm and a soldering void rate of less than 5% for copper blocks.
We are an IATF 16949 certified factory, and we strictly abide by the IPC-6012 Class 3 standard to meet the acceptance specifications for heavy copper plates.