Choosing between Rogers PCB and FR4 PCB materials is a critical decision that fundamentally shapes the performance, cost, and reliability of your RF or high-speed digital design. While FR4 has been the industry workhorse for decades, Rogers Corporation’s high-performance laminates have become the gold standard for demanding applications like 5G, automotive radar, and aerospace systems. This guide provides an objective, data-rich comparison to help you navigate this choice, and explains how partnering with an expert manufacturer like Jerico can unlock hybrid solutions that deliver Rogers-like performance at a fraction of the cost.
Core Material Properties: Rogers PCB vs FR4 PCB
The performance gap between Rogers and FR4 stems from their fundamental composition and material science. The table below quantifies the key differences that impact your design.
| Property | Standard FR4 PCB | Rogers PCB (e.g., RO4350B) | Design Impact & Implication |
|---|---|---|---|
| Dielectric Constant (Dk) | ~4.2 – 4.5 (Varies with freq., temp., supplier) |
3.48 ± 0.05 (Stable across frequency & temperature) |
Rogers Advantage: Enables precise, predictable impedance control (±5% typical). FR4’s variability can lead to ±10-15% impedance shift, causing signal reflection in sensitive RF paths. |
| Dissipation Factor (Df/tan δ) | 0.015 – 0.025 @ 1GHz | 0.0037 @ 10GHz | Rogers Advantage: 4-7x lower signal loss. At 28GHz, this can mean >3dB lower loss per inch, extending range or reducing amplifier power requirements. |
| Thermal Conductivity (W/m/K) | 0.25 – 0.30 | 0.62 | Rogers Advantage: ~2x better heat spreading helps manage thermal loads from power amplifiers, improving long-term reliability. |
| CTE (ppm/°C, Z-axis) | 50 – 70 | 32 | Rogers Advantage: Closer match to copper (17 ppm/°C) reduces stress on plated through-holes during thermal cycling, a critical factor for automotive (IATF 16949) and aerospace reliability. |
| Moisture Absorption | ~0.15% | < 0.02% | Rogers Advantage: Negligible Dk shift in humid environments, ensuring stable performance in outdoor or automotive applications. |
| Relative Cost | 1x (Baseline) | 3x – 5x | FR4 Advantage: Significant cost savings for budget-sensitive or non-critical applications. See Hybrid Stackup section for cost optimization. |
When to Choose a Rogers PCB Over FR4: Application Guidelines
The decision isn’t always black and white. Here’s a practical guide based on application requirements:
✅ Choose Rogers PCB For:
- Frequencies > 2-3 GHz: Where FR4 losses become prohibitive.
- Critical Impedance Control: Phased array radar, high-speed SerDes (>25 Gbps) where phase consistency is key.
- Extreme Environments: Automotive under-hood, aerospace, outdoor telecom with wide temperature swings.
- Low-Loss Antenna Feeds: 5G mmWave antenna-in-package (AiP) or feed networks.
Example: A 77GHz automotive radar front-end module. Using Rogers RO4835™ ensures minimal signal loss and stable antenna performance across -40°C to +125°C.
✅ FR4 PCB is Sufficient For:
- Digital Baseband / Control Logic: Low-speed MCU, memory, power management circuits.
- Low-Frequency Analog: Audio, sensor interfaces, DC power regulation.
- Cost-Driven Consumer Electronics: Where performance margins allow.
- Prototyping Non-RF Sections: Initial proof-of-concept builds.
Example: The digital control board for the same radar system, handling CAN bus communication and power sequencing, can reliably use FR4.
💡 The Cost-Performance Analysis
While a Rogers PCB may cost 3-5x more than FR4 per square inch, consider the total system cost:
- Using Rogers RO4350B™ in a power amplifier (PA) can reduce insertion loss by 2-3 dB.
- This may allow the use of a smaller, cheaper PA die or lower-power device, saving $5-$15 in component costs.
- Better thermal conductivity can reduce heatsink size or complexity.
- Higher reliability can lower warranty and field failure costs.
The Smart Compromise: Rogers/FR4 Hybrid Stackup by Jerico
Most advanced systems don’t require Rogers material for every layer. Jerico’s engineering expertise lies in designing and manufacturing hybrid or mixed-dielectric stackups, which strategically place Rogers material only where it’s needed most.
How Jerico Enables Reliable Hybrid Stackups
Bonding Rogers and FR4 materials in one board is non-trivial due to different resin systems and CTEs. Jerico’s certified processes ensure reliability:
- Material Compatibility Database: Leveraging experience with thousands of builds, we know which Rogers/FR4/prepreg combinations bond successfully.
- Controlled Lamination Process: Our IATF 16949 certified production uses precise temperature and pressure profiles to ensure perfect bonding without delamination.
- Design for Manufacturing (DFM): We guide you on optimal layer ordering, transition zones, and via placement to mitigate stress.
Example: 10-Layer 5G Small Cell Board
Hybrid Stackup Structure:
• L1-L2, L9-L10: Rogers RO4350B (Critical RF front-end and antenna connections)
• L3-L8: Mid-loss FR4 or Isola FR408HR (High-speed digital routing, power, and ground planes)
Result: Achieves >90% of the RF performance of an all-Rogers board at a ~40% lower material cost.
Why Partner with Jerico for Your Rogers or FR4 PCB?
Choosing the right material is half the battle; finding a manufacturer that can execute it with precision is the other. As a factory-direct manufacturer, Jerico provides distinct advantages:
Direct Material Access & Expertise
We procure Rogers materials directly and maintain strategic stock. Our engineers understand the nuances of different Rogers series (RO3000®, RO4000®, RT/duroid®) and can recommend the optimal one for your frequency and cost target.
Certified High-Reliability Manufacturing
Our IATF 16949 and IPC Class 3 capabilities are not just certificates—they are embedded in our processes, ensuring that every Rogers PCB meets the highest standards for automotive and aerospace applications.
Rapid Prototyping to Volume
From 1-piece prototypes with 24-hour turnaround (for stocked materials) to high-volume production, we provide seamless scaling. Our No MOQ policy lets you test hybrid stackups risk-free.
Get a Free Stackup & Material Recommendation
Stop guessing. Send us your design requirements or Gerber files. Our engineering team will perform a free analysis and provide a detailed comparison of FR4, Rogers, and hybrid stackup options—complete with performance projections and cost breakdowns.
Contact Our Engineering TeamFrequently Asked Questions (Rogers PCB vs FR4 PCB)
Yes, this is called a hybrid or mixed-dielectric stackup. It is a specialty of Jerico. The key is using compatible materials and a controlled lamination process. For example, Rogers RO4350B laminates well with certain FR4 grades using specific prepregs. We design the stackup to manage the different coefficients of thermal expansion (CTE) and ensure long-term reliability through thermal cycling tests. This approach is common in 5G and radar designs to control costs.
Yes, it requires more specialized processes. Rogers materials (especially PTFE-based ones) have different drilling, desmear, and surface preparation requirements compared to FR4. For instance, they often need plasma treatment for proper hole wall preparation to ensure good copper plating adhesion. Not all PCB factories have this expertise. Jerico has dedicated high-frequency production lines with the appropriate equipment and process controls, certified to IATF 16949 standards, to handle Rogers materials consistently.
The cost is justified when system performance or reliability depends directly on the PCB’s material properties. Key indicators include:
- Frequency > 3-5 GHz: Where FR4’s loss would degrade signal integrity.
- Strict Impedance/Phase Control: Needed in phased arrays, high-speed differential pairs.
- High Power or Thermal Stress: Where FR4’s lower Tg or higher CTE could cause failure.
- Harsh Operating Environments: Automotive, aerospace, outdoor telecom where temperature and humidity vary widely.
