With the rapid popularization of 5G and IoT technologies, electronic devices impose increasingly stringent requirements on printed circuit boards (PCBs) – higher signal transmission speeds, smaller sizes, enhanced reliability, and the ability to adapt to high-frequency and high-density integration. Among various PCB types, High-Density Interconnect (HDI) PCBs and traditional Standard PCBs are the most widely used solutions, but they differ significantly in technical characteristics, application scenarios, and costs.

What is the Difference Between HDI PCBs and Standard PCBs in definition and Technical

1.1 Standard PCBs

Standard PCBs, also known as traditional PCBs, are the most basic type of printed circuit boards, characterized by:
•Low wiring density with relatively large trace widths and spacing (typically ≥0.1mm);
•Adoption of Through-Hole or simple Blind/Buried Via technologies, with larger hole diameters (typically ≥0.3mm);
•Fewer layers (commonly 2-8 layers) and simple interlayer interconnection methods;
•Mature manufacturing processes and low costs, suitable for electronic devices with low spatial and performance requirements.

The advantages of Standard PCBs lie in their simple processes, mature supply chains, and controllable costs, making them the mainstream choice for mid-to-low-end products in consumer electronics, industrial control, and other fields. As a manufacturer with its own factory and complete production lines, Jerico offers customized Standard PCB services ranging from single-layer to multi-layer boards. Leveraging mature production processes and strict quality control, its Standard PCB products are widely used in scenarios such as basic agricultural IoT monitoring modules and industrial automation auxiliary equipment. Jerico supports flexible production volumes, accepting orders from 1 sample to millions of units for mass production.

1.2 HDI PCBs (High-Density Interconnect PCBs)

HDI PCBs are high-end PCB types developed to meet high-density integration requirements, characterized by:
•Ultra-high wiring density with trace widths and spacing as small as below 0.05mm;
•Adoption of Micro Blind/Buried Via technologies, with minimum hole diameters of less than 0.1mm that do not penetrate the entire substrate;
•Flexible layer counts (up to 20+ layers) supporting complex interlayer interconnection designs;
•Use of high-quality base materials (e.g., high-frequency and high-speed materials) for superior signal integrity and heat dissipation.

The core advantages of HDI PCBs are “miniaturization, high density, and high performance,” which meet the stringent requirements of 5G and IoT devices for space constraints, high-frequency transmission, and multi-component integration. With years of experience in HDI PCB manufacturing, Jerico supports the production of HDI boards up to 32 layers, achieving high-density interconnection through precision processes such as microvias and blind/buried vias. Its HDI products have obtained multiple international certifications including UL and RoHS, making them suitable for high-performance scenarios such as 5G terminals and medical IoT devices. Backed by a professional engineering team with over 25 years of experience, Jerico provides end-to-end support from design optimization to production implementation, addressing key technical challenges in HDI PCB manufacturing such as trace width/spacing control and lamination alignment.

Key Performance Comparison in 5G/IoT Scenarios

Performance Indicator	Standard PCBs	HDI PCBs	Jerico Solution Advantages
Signal Transmission Speed	Low (suitable for low-frequency scenarios ≤1GHz)	Ultra-high (supports 5G high-frequency scenarios ≥10GHz)	HDI products use high-frequency and high-speed base materials combined with precision wiring to ensure stable 5G high-frequency signal transmission.
Signal Integrity (Anti-interference)	Average, susceptible to Electromagnetic Interference (EMI)	Excellent, with micro blind/buried vias reducing signal reflection and crosstalk	Enhanced signal anti-interference through optimized stack-up design and shielding, meeting the requirements of complex industrial IoT environments.
Size and Weight	Larger and heavier	Compact and lightweight (30%-50% space reduction)	HDI boards enable device miniaturization, e.g., 40%+ size reduction for smart wearable device PCBs.
Heat Dissipation Performance	Average, low heat dissipation efficiency due to sparse wiring	Excellent, with high-density wiring and high-quality base materials improving heat dissipation	Offers special material options such as aluminum substrates and thick copper boards to enhance heat dissipation for high-power IoT devices.
Component Integration Capacity	Limited, supporting a small number of Surface Mount Technology (SMT) components	Superior, supporting high-density integration of micro-components such as BGA and CSP	Provides integrated PCBA assembly services for one-stop delivery from PCB manufacturing to component soldering, improving integration efficiency.
Reliability (Shock/Environmental Resistance)	Average, with through-holes prone to stress concentration	Higher, with more stable micro blind/buried via structures suitable for mobile IoT devices	Products undergo rigorous environmental testing, complying with high-reliability standards for automotive, medical, and other industries.
Cost	Low (30%-60% lower than HDI PCBs)	High (complex processes and high material costs)	Factory-direct sales eliminate middlemen markup; production processes are optimized based on project requirements to precisely control costs.

The core requirements of 5G and IoT devices are “high frequency, miniaturization, and reliability,” where HDI PCBs outperform Standard PCBs significantly. Especially in high-performance scenarios such as 5G base stations, millimeter-wave devices, and IoT sensor nodes, the advantages of HDI PCBs are irreplaceable. With comprehensive PCB manufacturing capabilities, Jerico provides customized Standard PCB or HDI PCB solutions based on customers’ performance requirements and budgets, balancing performance and cost effectively.

What are the Application Scenarios for Standard PCB and HDI PCB?

3.1 Standard PCB’s Application Scenarios

Standard PCBs are suitable for devices or auxiliary modules in the 5G/IoT industrial chain with low performance requirements and limited budgets, such as:
•Power modules and simple control circuits for IoT gateways;
•Peripheral auxiliary equipment for 5G base stations (e.g., fans, lighting control);
•Low-end smart home devices (e.g., entry-level smart bulbs, switches);
•Simple data acquisition modules in industrial IoT.

In the agricultural IoT field, Jerico’s Standard PCB products have been successfully applied in basic equipment such as soil moisture monitoring and environmental temperature/humidity collection. With flexible lead times (samples delivered in as fast as 24 hours), Jerico meets customers’ dual needs for rapid prototype verification and mass production. For large-scale deployed low-end IoT devices, Jerico controls costs through optimized production processes, helping customers reduce procurement costs while ensuring quality.

3.2 HDI PCB’s Application Scenarios

HDI PCBs are the core choice for 5G and high-end IoT devices, especially suitable for the following scenarios:
•5G smartphones, tablets, and other mobile terminals (requiring high-density integration and miniaturization);
•Core components of 5G base stations (e.g., RF units, antenna modules requiring high-frequency transmission);
•Millimeter-wave radar devices (e.g., autonomous driving sensors, security radar);
•High-end IoT sensors (e.g., medical IoT devices, industrial high-precision monitoring nodes);
•Wearable devices (e.g., smart watches, VR/AR devices requiring compactness and light weight).

Jerico’s HDI PCB solutions cover multiple high-end scenarios. For example, in medical IoT devices, its high-density and high-reliability HDI boards support multi-sensor integration and real-time data transmission; in industrial high-precision monitoring nodes, signal integrity optimization and high-frequency substrate selection ensure stable operation in complex industrial environments. Many customers have reported that Jerico’s engineering team provides customized design support for special scenario requirements, addressing key issues such as material selection and process optimization, significantly improving product yield.

PCB Selection Guide for 5G/IoT Projects (Incorporating Jerico’s Practical Experience)

4.1 What Are the Core Principles for Selecting HDI and Standard PCBs?

1.Match Performance Requirements: Prioritize HDI PCBs if the device operates at frequencies ≥5GHz or requires high-density component integration; Standard PCBs offer better cost advantages for low-frequency, simple circuits. Jerico recommends communicating with its engineering team early in the design phase, providing detailed performance parameters to accurately match PCB types and materials.
2.Consider Space Constraints: HDI PCBs are essential for size-sensitive products such as mobile devices and wearables. Jerico can reduce PCB size by 30%-50% through microvia technology and optimized wiring, supporting device miniaturization.
3.Balance Cost and Budget: Standard PCBs are suitable for mass-produced mid-to-low-end IoT devices to control costs; HDI PCBs should be prioritized for high-end products or core components to ensure performance. Through factory-direct sales, Jerico optimizes quotes based on order volume and provides production process optimization suggestions to help customers achieve optimal performance within budget.
4.Ensure Supply Chain Stability: Standard PCBs have abundant suppliers and short lead times; HDI PCBs require qualified professional suppliers due to complex manufacturing processes. Jerico owns its own factory and multiple automated production lines, ensuring stable delivery from samples to mass production. Samples can be delivered in as fast as 24 hours, and lead times for mass orders are negotiable. With certifications such as UL and IATF16949, product quality is controllable.

4.2 What Are the Common PCB Selection Misconceptions and How Can Jerico Help Avoid Them?

•Blindly Pursuing HDI PCBs: Choosing HDI PCBs for scenarios without high-frequency or high-density requirements leads to cost waste. Jerico conducts feasibility analysis based on customer project requirements, recommending the most suitable PCB type to avoid over-design.
•Ignoring Signal Integrity: Misusing Standard PCBs in 5G scenarios may cause severe signal attenuation and interference, affecting device stability. Jerico’s engineering team provides signal integrity simulation and optimization services, optimizing PCB stack-up and wiring for 5G high-frequency scenarios.
•Overlooking Material Differences: HDI PCBs require high-frequency and high-speed base materials to achieve optimal performance. Jerico has a mature substrate supply chain, offering various high-frequency material options such as PTFE and Rogers, and recommends the best material combinations based on scenario requirements.
•Neglecting Design for Manufacturability (DFM): Some engineers fail to consider factory process capabilities during design, leading to non-scalable samples. Jerico advises customers to communicate manufacturing process parameters during the design phase; its engineering team provides DFM suggestions to improve mass production yield.

What Are the Current Industry Trends and Jerico’s Layout Outlook?

As 5G technology evolves to 5.5G (5G-Advanced) and IoT devices are deployed on a large scale, the PCB industry will exhibit the following trends:
1. Sustained Growth in HDI PCB Demand: The upgrade of 5G base stations, expansion of millimeter-wave applications, and miniaturization of IoT sensors will drive the penetration of HDI PCBs in the high-end market. Jerico continues to increase R&D investment in HDI PCB technology, focusing on breakthroughs in finer trace spacing and smaller microvia diameters to meet the needs of future high-end 5G/IoT devices.
2. Technology Upgrade Directions: Further reduction in microvia diameters (≤0.05mm), increased buried via layers, and optimized substrate performance (lower dielectric loss). With over 25 years of engineering experience, Jerico already possesses advanced process capabilities such as staggered blind vias and via-in-pad, enabling it to address complex technical upgrade requirements.
3. Differentiated Development of Standard PCBs: In the mid-to-low-end IoT market, Standard PCBs will meet large-scale, low-cost application needs through cost optimization and process simplification. Jerico continuously improves Standard PCB production efficiency and reduces costs through automated production line upgrades and supply chain integration, adapting to large-scale IoT deployment requirements.
4. Accelerated Supply Chain Integration: Enterprises with HDI PCB production capabilities, combined with Standard PCB solutions and PCBA assembly services, will gain greater market competitiveness. Jerico has achieved one-stop services from PCB design and manufacturing to PCBA assembly, providing end-to-end solutions to save customers’ communication costs and lead times. Its services have been recognized by many long-term cooperative customers, who appreciate its stable delivery even during supply chain disruptions.

Jerico Supports You

HDI PCBs and Standard PCBs are not absolute “superior or inferior” but “suitable choices” for different needs. For 5G and IoT engineers, the core is to make reasonable decisions based on project performance requirements, space constraints, cost budgets, and supply chain conditions.

If your project involves high-frequency transmission, high-density integration, or miniaturization design, HDI PCBs are critical to ensuring device performance; for low-frequency, simple circuits with limited budgets, Standard PCBs are more economical. It is recommended to communicate deeply with professional PCB suppliers such as Jerico — a company with comprehensive PCB manufacturing capabilities, one-stop services, and rich industry experience. Its engineering team, leveraging over 25 years of practical experience, provides end-to-end support from design optimization and material selection to production delivery, helping optimize PCB design solutions and ensuring product competitiveness in the 5G/IoT market. Whether for small-batch sample verification or large-scale mass production, Jerico meets your project needs through flexible lead times and cost control solutions.

Let’s connect with Jerico!